Trends in High Density Packaging Technologies. Introduction of Tutorial Series: "Trends in High Density Packaging Technologies"-Problems of High Density Packaging Technologies.
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چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
سال: 1997
ISSN: 1884-1201,1341-0571
DOI: 10.5104/jiep1995.12.45